The surface-mount Mod5 Series Flip-Top BGA sockets suit test, validation, and debug for 0.50-mm-pitch devices used in handheld and wireless applications. The 20 x 27-mm sockets can accommodate ...

Presenting the new, .050” (1,27 mm) pitch solder cup headers and sockets for termination of fine gauge wires and cables. These solder cup connectors are ideal for applications that demand a highly ...

Manufacturers of ball-grid-array (BGA) burn-in sockets are using a variety of processes to help them keep pace with the testing requirements posed by today's faster and denser integrated circuits.