与今年1月率先推出的P100系列 (4-6核)相比，新产品尽管同样基于Zen 5 CPU、RDNA 3.5 GPU与XDNA 2 NPU的单芯片异构架构设计，但无论是CPU核心数量，还是图形处理能力、系统运算性能，均实现了更大幅度的提升，在为边缘AI场景提供更高效计算解决方案的同时，也标志着AMD在嵌入式异构计算领域的布局完成关键升级。

2026年CES展台上，AMD首席执行官苏姿丰将重达3200公斤的Helios双倍宽度AI机架直接搬上舞台，这一震撼展示不仅是对NVIDIA的正面挑战，更是对全球AI算力市场格局的重塑宣言。拉斯维加斯的2026年国际消费电子展（CES）成为全球AI算力竞争的关键战场。在英伟达发布Vera ...

Forbes contributors publish independent expert analyses and insights. Founder and Principal Analyst, Cambrian-AI Research LLC AMD held their now-annual Advancing AI event today in Silicon Valley, with ...

TL;DR: AMD will launch the Radeon AI PRO R9700 workstation GPU on July 23, featuring 32GB GDDR6 memory and RDNA 4 architecture. Optimized for AI workloads, it offers up to 496% faster inference than ...

AMD Helios rack-scale solution. These are liquid-cooled, 72-GPU racks powering AMD Instinct MI450 Series GPUs, AMD EPYC CPUs (Venice) and do feature integrated UALoE scale-up connectivity. Oracle ...

What if the key to unlocking faster, more efficient machine learning workflows lies not in your algorithms but in the hardware powering them? In the world of GPUs, where raw computational power meets ...