The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...

TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series’ BGAs are ...

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...

Fig. 1. Because a socket adapter has a lower mass than a BGA, soldering the BGA to a socket adapter subjects it to less thermal stress than soldering it directly to the pc board. If, for example, the ...

And the special thing here is that is is a BGA chip, as in Ball Grid Array. Intel is to fab an SSD BGA-mounted 1TB Intel SSD. As the info reveals, the new package is actually larger than the NAND on ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...