The GI-307 High-Speed Inspection System from General Inspection, LLC (Gi) combines 360 degree dimensional metrology with 360 ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

General Inspection, LLC (Gi), a leader in high-performance fastener sorting technology, is pleased to announce the successful ...

Researchers have tested eight stand-alone deep learning methods for PV cell fault detection and have found that their accuracy was as high as 73%. All methods were trained and tested on the ELPV ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Within the context of semiconductor inspection and failure analysis, latent defects present a significant challenge because they make it difficult to determine whether a fault originated during ...

Innovative magnetic robots for steel bridge inspection utilize AI and advanced sensors, ensuring effective defect detection and structural health monitoring.