CTS Electronic Components, Incorporated announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. These heat sinks are ...

Brisbane, Queensland, Australia--(Newsfile Corp. - December 11, 2024) - Graphene Manufacturing Group Ltd. (TSXV: GMG) (OTCQX: GMGMF) ("GMG" or the "Company") is pleased to provide a business update on ...

Medical imaging is getting smarter, smaller and more capable. Devices that once filled entire rooms now fit in your hand, ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

All-metal bonded-fin heat sinks provide a more effective, compact heat removal system, with improvements over both epoxy-bond heat sinks and other existing bonded-fin products. Ever-increasing levels ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

Today, we continue our amd frame Project - over the coming months we are going to create a heavily customised build for AMD.

If you run a computer without thermal compound on the processor, you could soon be in the market for a new processor. Thermal compound, also known as thermal paste and thermal grease, is a material ...

CTS Electronic Components, Incorporated announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. These heat sinks are ...

Figure 3: A heat sink coated with THERMAL-XR® on all sides, excluding the base, that is 39% smaller achieves the same results and temperature as the bare aluminium heat sink depicted in Figure 1.