Today voice and data already share the high-bandwidth pipes into an enterprise, through frame relay protocols, voice over IP, firewalls for communications systems and automated call center systems. As ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...

For many of today’s embedded applications, compute requirements demand multiple cores (compute units). These applications also run various types of workloads. A ...