Custom-designed, photochemically etched surface-mount and insert-mount lead frames for integrated circuit manufacturing are now available. The frame’s base materials include Kovar, nickel-iron alloys, ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

The quad flat no-leads (QFN) package is a low-cost, lead frame-based package that’s very common in the semiconductor industry. QFN packages have small footprints and adapt well to most silicon devices ...