TI宣布面向智能手机、平板电脑以及其它便携式电子设备推出业界最小型的集成升压DC/DC电源模块。最新高效率TPS81256 MicroSiP ...

TI推出最小 DC/DC 模块 可在360nA电流下为新一代可穿戴设备供电,全面集成型200mA MicroSiP模块，尺寸仅为 6.7 平方毫米，比其它降压转换器小 75%.

The TPS82740 is a 200 mA step down converter module with 360 nA quiescent current. It is a complete MicroSIP™ DC/DC step-down power solution designed for ultra low ...

TI's new TPS82740A and TPS82740B step-down converter modules support 200-mA output current with 95 percent conversion efficiency and consume only 360 nA of quiescent current during active operation ...

OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources. Save my User ID and Password Some ...