LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Fig. 1. Trade-off between fidelity/accuracy and simulation time for different solutions providing thermo-chemical analysis of composite parts during processing. Photo Credit: Convergent Manufacturing ...
Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...
DUBLIN--(BUSINESS WIRE)--The "Cloud Based Simulation Applications - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. The global market for Cloud Based ...
The use of engineering and scientific simulation techniques to understand and predict the real-world behavior of physical phenomena is widespread across a number of diverse industries. This is true ...
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