If you've ever tenuously probed an expensive IC in a surface-mount package, you'll appreciate these new test adjuncts from Emulation Technology (ET—Santa Clara, Calif.). It's rolling out test clips ...

Exploiting a proven spring-probe design, the QUAD-4 test clip ensures secure, non-evasive contact for Micron TSOPII packaged ICs. It is designed to clip over surface-mounted DDR SDRAM memories in the ...

High-frequency center-probe test sockets are available for ball grid array, chip-scale, and micro land frame packages with a lead pitch of 0.30 mm. Features include a four-point crown or sharp-point ...