LEUVEN, Belgium — The IMEC research center has developed a design tool for modeling and analyzing noise generated in silicon substrates and is looking to launch the technology through an EDA company, ...

QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ — Introduction: The Foundation of Packaging Performance In the global packaging industry, substrate BOPP film (Biaxially Oriented ...

(MENAFN- EIN Presswire) EINPresswire/ -- A growing emphasis on advanced semiconductor packaging solutions is shaping the organic substrate packaging material market. As technology evolves rapidly, ...