2.5D和3D最本质的区别是：2.5D有中介层interposer, 3D没有interposer层面！ 硅通孔（Through Silicon Vias，简称TSV）是一种在硅晶圆(而不是基板或PCB上)上制作垂直贯通的微小通孔，并在通孔中填充导电材料，实现芯片内部不同层面之间的电气连接的技术。这种技术能够显著 ...

本研究针对CBCT图像中下颌管(MC)手动分割效率低、易受主观影响的问题，系统比较了2D、2.5D和3D CNN及3D Swin UNETR在相同GPU内存下的分割性能。3D-UNet通过IC技术和多平面Dice损失(MDL)显著提升边界细节与结构连续性（JI 0.569±0.107，DSC 0.719±0.092），为口腔颌面手术规划 ...

（编辑推荐）本综述系统探讨了4D/5D打印技术在特殊医学用途食品（FSMPs）领域的突破性应用，通过智能材料实现形状、颜色 ...

Following is the transcript of the video. Narrator: This is 2D hand-drawn animation. [horns toot] And this is 3D computer-generated animation. But many films actually fall somewhere in between -- or ...

Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface ...

2D: Bioluminescence, fluorescence and Cherenkov. High-throughput: Able to image up to 10 animals simultaneously. Adjustable FOV/resolution/throughput. Enabling ...