Electrostatic discharge (ESD) protection is critical at advanced nodes to safeguard designs against effects intensified by shrinking transistor dimensions and oxide layer thicknesses. On the other ...

The IC can be used to simplify the design of products that can act as a power source for connected devices as well as accepting power from other USB-C sources. When used as a companion chip with ...

Geneva, November 8, 2021 – The STMicroelectronics TCPP03-M20 USB Type-C port-protection IC is tailored for Dual-Role Power (DRP) applications, simplifying the design of products that can act as a ...

Electrostatic discharge (ESD) is caused by the discharge of an excess or deficiency of electrons on one surface with respect to another surface or to ground. When a static charge is present on an ...

•ESD protectors with low dynamic resistance won’t necessarily protect circuits. •Most damage is caused within the first nanosecond of an ESD event. •The ESD protector should set as close as possible ...

A very cost-effective solution for ESD protection in USB 2.0/3.0 applications is to combine an internal ESD protection structure (integrated in the USB transceiver) with a robust, high-current ...

Fig 1. Comparison of a traditional ESD protection design methodology and the PicoGuard XS architecture shows how the latter can provide matched inductance. Fig 2. In a traditional ESD device, the ...