Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

A new technical paper titled “Channel-last gate-all-around nanosheet oxide semiconductor transistors” was published by ...

When the Meltdown and Spectre vulnerabilities were first uncovered in 2018, they heralded an industry-wide shift in perspective regarding processor security. As the IBM X-Force Threat Intelligence ...

A new technical paper titled “Deep-learning atomistic semi-empirical pseudopotential model for nanomaterials” was published ...

A new technical paper titled “Hardware Acceleration for Neural Networks: A Comprehensive Survey” was published by researchers ...

Generative Golden Reference Hardware Fuzzing” was published by researchers at TU Darmstadt. Abstract “Modern hardware systems ...

What chip industry engineers were watching this year.

In-space IC materials; TSMC's 2nm volume production; Chinese hybrids flood Europe; copper price surges; SMIC's takeover; ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

A new technical paper titled “Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference” was published by researchers at Rensselaer Polytechnic Institute, ScaleFlux and IBM T.J.

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology. They concluded that by the 3nm node, only a few ...