In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Scientists have found a promising new way to manufacture one of industry’s toughest materials—tungsten carbide–cobalt—using advanced 3D printing. Normally, producing this ultra-hard material requires ...

A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for ...

Yield loss is increasingly driven by molecular variability in thin films, interfaces, and contamination rather than visible defects. Reliability issues often appear first as parametric drift or margin ...

Traumatic muscle injury can be associated with volumetric muscle loss (VML), often leading to permanent functional loss.

The researchers, along with partners from industry and government railroad organizations, applied an advanced form of ultrasound featuring new beamforming algorithms to develop a ...

Cornell researchers have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance.

The previous solar efficiency record has now been broken, and this one could have ...

Researchers at Cornell University have developed a powerful imaging technique that reveals atomic scale defects inside computer chips for the first time. Using an advanced electron microscopy method, ...

Examining light management in all-perovskite tandem solar cells, this review focuses on optimizing optical design to enhance ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

Cornell researchers have used advanced electron microscopy to identify "mouse bite" defects in 3D transistors for the first time ...