Abstract: A through-silicon via (TSV) is a conducting copper nail, which provides an electrical connection through a substrate, and is expected to be used extensively to provide high-speed ...

Abstract: Visual steel surface defect detection is an essential step in steel sheet manufacturing. Several machine learning-based automated visual inspection (AVI) methods have been studied in recent ...

AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.

Machine learning (ML) is reshaping pipeline integrity management (PIM) from physics-based to data-driven paradigms. This ...

NVIDIA (NASDAQ:NVDA) revealed that Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) is deploying a range of its artificial ...

Nvidia and the world’s largest foundry TSMC are collaborating to speed up semiconductor design and manufacturing. Under the ...

TSMC is using NVIDIA Metropolis and NVIDIA TAO Toolkit to advance automated defect inspection with vision AI, improving ...

TSMC is using NVIDIA AI and CUDA-X technologies to cut chip manufacturing costs, improve yields, and speed up production.

Advanced process control: TSMC is using the NVIDIA cuML machine learning library to accelerate large-scale analytics on NVIDIA GPUs. This lets TSMC speed algorithms and distill hundreds of thousands ...

The chip equipment maker is working with NUS and SIT to speed process development and train engineers for automated ...