Epoxy combined with “ultrastiff” graphene foam invented in the Rice lab of chemist James Tour is substantially tougher than pure epoxy and far more conductive than other epoxy composites while ...

Rice University scientists have built a better epoxy for electronic applications. Epoxy combined with "ultrastiff" graphene foam invented in the Rice lab of chemist James Tour is substantially tougher ...

Master Bond EP30HV, a two part epoxy, offers high light transmittance from 350-2,400 nm and has a refractive index of 1.55 at room temperature. It features enhanced electrical and thermal insulation ...

A wide range of one and two component epoxy adhesive systems have been developed by Master Bond Inc. for applications requiring high tensile strength properties. These diverse formulations offer ...

One part heat cured epoxy adhesive EP17HT has outstanding thermal stability and physical strength properties. The Tg of this product is > 220°C. It is curable at 300°F in 90 to 120 minutes or at 350°F ...

The EP21ARHT is a two-component epoxy adhesive, sealant, coating, and encapsulation system featuring high bond strength, and exceptional chemical resistance to acids. The EP21ARHT is a two-component ...

Master Bond EP39MHT is a two component, epoxy system for high performance bonding, sealing, coating, potting and encapsulation. This epoxy is an excellent adhesive and bonds well to a wide variety of ...

Master Bond Supreme 10HT is a uniquely versatile system that combines high shear and peel strengths with convenient handling. This one part system eliminates mixing and cures in just 60-75 minutes at ...