Abstract: This paper investigates the thermal performance of multi-layer metal interconnects in three-dimensional (3D) stacked structures through finite element analysis (FEA). The 3D integrated ...

If this machine had hit the shelves just a few months ago, it would have gone straight to the top of our best 3D printers list. It's absolutely superb. However, in the wings are the new multitool ...

A team led by academician Huang Ru and Professor Wu Yanqing from the School of Integrated Circuits at Peking University has developed a super-thin, high-performance semiconductor with enhanced heat ...

When I was asked to give an impromptu five-minute speech and then to count backwards in intervals of 17 - all in front of a panel of three strangers - the acute stress was written on my face. That is ...

Watch science correspondent Victoria Gill put herself through a thermal imaging stress test When I was asked to give an impromptu five-minute speech and then to count backwards in intervals of 17 - ...

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Abstract: Thermal management plays an increasingly important role in the design of 3-D integrated circuits (ICs) and packages. To deal with the related thermal issues, efficient and accurate ...

This is read by an automated voice. Please report any issues or inconsistencies here. Los Angeles firefighters didn’t use thermal imaging to confirm that a Jan. 1 fire was extinguished. The fire ...