Although the newer process of surface mount technology (SMT) has largely replaced through-hole technology (THT) as a PCB assembly method for high-volume production, THT still has its place in ...

Jetcam Intl. has launched a new 3D Unfolding software module developed in partnership with AutoPOL. An optional extension to the Jetcam Expert system, the module is designed to streamline the process ...

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Orbbec Inc. has released the Persee N1, which it claimed is “an all-in-one combination of a popular stereo-vision 3D camera and a purpose-built computer based on the NVIDIA Jetson platform.” The ...

For general information about how to structure Gradle builds and apply community plugins like this one you can check out my Understanding Gradle video series. Once the plugin is applied, dependencies ...

Abstract: In this study, a 3D package module based on flexible substrate is proposed. In order to improve the thermo-mechanical reliability of the 3D package module, the simulation of the key ...

The ModiTect project aims at providing productivity tools for working with the Java module system ("Jigsaw"). Currently the following tasks are supported: Generating module-info.java descriptors for ...

In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k ...

In this webinar, we will share our clinical experiences with RadCalc’s 3D EPID module. Firstly, the commissioning process of this 3D EPID module will be shown, and Wang Ruoxi will demonstrate their in ...

Analog Devices, Inc. (ADI) has claimed the industry’s first high-resolution, industrial-quality, indirect time-of-flight (iToF) module for 3D depth sensing and vision systems. The ADTF3175 module ...

Analog Devices launched a 1 megapixel module Monday for 3D depth sensing and vision sensing based on indirect Time of Flight technology. The tiny ADTF3175 module will allow accuracy within about 3mm ...