Abstract: Through-silicon via (TSV) is one of the key enabling technologies of stacked 3D ICs. However, the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the ...

An illustration of a magnifying glass. An illustration of a magnifying glass.

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Abstract: This paper explores the optimization of Costas arrays search through the utilization of bidirectional circular linked lists. Costas arrays are integral in various applications, such as ...

“Realignments are not always permanent,” Larner points out. “We saw in Scotland right after the independence referendum Labour essentially disappear, and now they’re sort of back. It’s never a death ...