EPC announces the launch of the EPC91120, a high-performance three-phase brushless DC (BLDC) motor drive inverter for ...

Abstract: In this study, the thermal characteristics and structure reliability during power cycling for the four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum ...

In this in-depth review of the Thermaltake Suppressor F51, we explore the features and benefits of this mid-tower computer case. Known for its sleek design and impressive noise reduction capabilities, ...

Abstract: This paper presents a comparative study between traditional and sustainable approaches on a power electronics inverter; it focuses on the thermal management of the DC-AC bridge thermal ...

Tijesunimi Akintunde is a PhD candidate in Mechanical Engineering at the University of Arkansas, where his research explores advanced cooling methods for high-density electronic systems. His work ...

Aluminum nitride (AlN) is a large bandgap semiconductor ceramic with a hexagonal wurtzite crystal framework, composed of alternating layers of light weight aluminum and nitrogen atoms bound through ...

SiC conversion boosts efficiency, power density, and thermal performance through optimized gate drive, thermal design, and EMI-aware system integration. Converting power electronic platforms from ...

The increase in demand for high performance computing is resulting in the need for enhanced semiconductor performance, of which thermal management is a large component. IDTechEx's report, "Thermal ...