Tata Electronics and the Centre for Development of Advanced Computing (C-DAC), under the Ministry of Electronics and Information Technology (MeitY), signed a Memorandum of Understanding (MoU) to ...
At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced new collaborations with TSMC to support the foundry’s latest process ...
When TSMC started making semiconductor chips, India too had a fab. The difference was India's first fab did not scale and grow. whereas TSMC reached the peaks of foundry technology. India's progress ...
Yole said back-end semiconductor equipment market faces short-term decline but anticipates recovery with adoption of advanced packaging techniques, where it outlines below points: The back-end ...
Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...
Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...
SK hynix developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. The success marks the beginning of the extreme scaling to the level closer to 10nm ...
Littelfuse released the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series. This groundbreaking series of TVS diodes is designed to safeguard ...
ABI Research said the chipset revenues from AI-dedicated silicon for IoT-focused applications reaching over US$7.3 billion by 2030. The trend driving this growth is due to embedded chipset vendors ...
Revenue from AI semiconductors globally is expected to total $71 billion in 2024, an increase of 33% from 2023, according to the latest forecast from Gartner, Inc. “Today, generative AI (GenAI) is ...
SK hynix has developed the Zoned UFS, or ZUFS1 4.0, a mobile NAND solution product for on-device AI applications. SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such ...
Littelfuse launched IX4352NE, a Low-side SiC MOSFET and IGBT Gate Driver IC specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in ...