Abstract: Parylene C is a thin-film polymer used as a biocompatible barrier layer in biomedical implants and implantable MEMS; free-film Parylene C may serve as both the substrate and insulation in ...

Abstract: Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will ...