Small and medium-sized enterprises (SMEs) often find it difficult to adopt advanced manufacturing technologies due to the ...

Abstract: In this article, we investigate the robust beamforming design for a simultaneous transmitting and reflecting reconfigurable intelligent surface (STAR-RIS) aided downlink rate-splitting ...

Takeda Development Center Americas, Inc., 9625 Towne Centre Drive, San Diego, California 92121, United States ...

Abstract: In this paper, we consider a reconfigurable intelligent surface (RIS)-assisted 3D direction-of-arrival (DoA) estimation system, in which a uniform planar array (UPA) RIS is deployed to ...

1 Bert S. Turner Department of Construction Management, Louisiana State University, Baton Rouge, LA, United States 2 LaHouse Research and Education Center, Department of Biological and Agricultural ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...