Abstract: A detailed study of Through-Silicon-Vias (TSV) electrical properties is presented. A basic test structure is a dual-TSV made of tungsten TSVs based on hybrid copper-adhesive wafer bonding.

Department of Polymer Science and Engineering, Department of Energy Engineering Convergence, Kumoh National Institute of Technology, Gumi, Gyeongbuk 39177, Republic of Korea ...

Code compliance issues for architects and regulators are a significant bottleneck to building safe, efficient infrastructure ...