It might echo the looks and feel of a 60-year-old design, but it's completely modern inside and promises to tackle any ...

Abstract: The rapid development of wide-bandgap semiconductors imposed stringent requirements for die attachment for power electronic packaging. Among which, sintered copper is becoming an advanced ...

The explosive rise in AI computing power is pushing the data center industry to rethink its entire architectural model, according to Vik Malyala, senior vice president for technology and AI at ...