Abstract: With the development of microelectronics packaging technology, the interconnection size of chip packaging has gradually decreased to 10μm.ACA (anisotropic conductive adhesive) packaging ...

Abstract: This study reports the application of a simple conical notch punched on a bonded structure set in air for the selective separation of an adherend by pulsed discharge, with the discharge ...

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Geneva, 28 October 2025: Wizz Air Holdings Plc ("Wizz Air"), Europe's environmentally most sustainable airline[1], announces it will issue audited H1 F26 results for the six months ended 30 September ...