MicroCloud Hologram Inc. , ("HOLO" or the "Company"), a technology service provider, proposed an innovative hardware ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
An Ensemble Learning Tool for Land Use Land Cover Classification Using Google Alpha Earth Foundations Satellite Embeddings ...
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