MicroCloud Hologram Inc. , ("HOLO" or the "Company"), a technology service provider, proposed an innovative hardware ...

Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

An Ensemble Learning Tool for Land Use Land Cover Classification Using Google Alpha Earth Foundations Satellite Embeddings ...

Abstract: With the development of China’s economy and society, the layout of power grid construction is constantly improving. In the construction of transmission line frameworks, facing complex ...