Abstract: This paper proposes an omnidirectional antenna-in-package (AiP) for THz chip-to-chip (C2C) wireless interconnect applications, based on fan-out wafer-level package (FOWLP). The microstrip ...
Abstract: A horizontally polarized omnidirectional (HPO) antenna with ultralow cross-polarization level (XPL) is presented for a 2.4 GHz wireless local area network (WLAN) application. The proposed ...
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