Prevent this by regularly cleaning dust from cooling components, ensuring good airflow, replacing degraded thermal paste, and avoiding aggressive overclocking without adequate cooling. 3. Can having ...

Abstract: Most microelectronic packages consist of multilayered structures made of dissimilar materials. Therefore, interfacial delamination is a common failure mechanism due to the mismatch in the ...

Abstract: A critical review is made in this paper to summarize the recently published studies about the growth kinetics of intermetallic compound (IMC) in solderjoints during thermal cycling in the ...