Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are contamination-free to aid the attachment process, ...

10-31-2025 Bart Berenbak [email protected] Besi Netherlands ...

PAC Strapping Products highlights its Polypropylene Strapping, a lightweight, cost-effective solution for a broad range of bundling, unitizing, and carton-closing applications. ... This cleaner has 2 ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This cleaner has 2 ultrasonic cleaning head panels for ...

HydroGraph Clean Power Inc. announced that it has been granted U.S. Patent No. 12,378,948 for a novel actuator technology that uses electrically conductive porous carbon ... Semiconductor Packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. A Sigma eliminates ...

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection ...

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This cleaner has 2 ultrasonic cleaning head panels for ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Amkor's SiP technology is an ideal solution in markets ...